FuzionOF Platform

Description

Key Points:-

• Surface mount platform designed for odd-form, pin-in-paste, and standard SMT assembly.

• Handles components up to 150mm square and up to 40mm in height.

• Provides programmable placement force up to 5kg.

• Consolidates surface mount and odd-form processes within a single machine footprint.

Transform your back-end assembly operations into a high-efficiency strategic advantage with the FuzionOF™ Platform, distributed in Singapore and the region by JEC Technology. Engineered to bridge the gap between high-speed surface mount placement and complex non-traditional assembly, FuzionOF™ delivers the highest available odd-form automation throughput on the market. By integrating advanced odd-form capabilities directly onto a standard surface mount platform, it significantly cuts cycle times, eliminates production bottlenecks, and maximizes line output.

Whether your process calls for pin-in-paste odd-form, surface mount odd-form, or standard SMT placement, this versatile platform easily accommodates your most demanding manufacturing requirements. It supports a full spectrum of leaded and non-leaded odd-form devices up to 150mm square and up to 40mm in height, backed by a robust 5kg placement force. At JEC Technology, we are dedicated to helping you deploy FuzionOF™ so your production line remains agile, precise, and prepared for modern electronics assembly challenges.

Key Features

Unmatched Automation Throughput & Universal Flexibility

The FuzionOF™ Platform redefines odd-form automation by delivering industry-leading placement speed across a wide array of light-duty and non-traditional devices. Built on a proven SMT architecture, it allows manufacturers to consolidate standard surface mount and specialized odd-form processes within a single machine footprint. This seamless capability removes tedious manual placement steps, improves board quality, and maintains high yield rates across diverse production runs.

Broad Component Range & Controlled High Placement Force

Designed for complete component versatility, FuzionOF™ effortlessly handles large-format components up to 150mm square and tall form factors up to 40mm high. Equipped with programmable placement force up to 5kg, the platform ensures secure, precise seating for heavier or tight-fitting odd-form components—such as connectors, transformers, and shields—without risking mechanical stress or damage to sensitive substrates and leads.

Optimized Pin-In-Paste Performance & Trusted Local Support

FuzionOF™ is purpose-built for pin-in-paste and surface mount odd-form applications, delivering fast tact times and superior repeat accuracy on complex PCBA designs. Backed by JEC Technology’s deep domain expertise and dedicated local service support in Singapore, integrating FuzionOF™ into your manufacturing floor ensures smooth deployment, maximized uptime, and a strong return on investment.