Designed to address splicing process inefficiencies, quality concerns and production bottlenecks
The L-4 intelligent splicing solution not only integrates with MES for superior traceability but also delivers unmatched precision, reliability, and ease of use. With its cutting-edge features, the L-4 transforms the splicing process into a streamlined, high-efficiency operation, making it an essential tool for modern SMT electronics manufacturing.
With a comprehensive range of component handling and input types, various standard tooling, and personalized design and implementation services, the FuzionOF addresses and caters to almost any odd-form application
FuzionOF™ incorporates precise, repeatable, closed-loop processes that reduce defects, rework and waste.
Additional optional functions available to add versatility and adapt machine to fit your inspection process and needs.
Made for inspection, failure analysis and package inspection of PCBs and Electronic Assemblies including
SMT Assemblies
Advanced Splicing capabilities
Precise and Reliable Splicing for a Wide Range of Components
Smart Vision & LCR Verification
Ensure Quality Control and Compliance with Standards
Automation for efficiency
Optimize operational efficiency, boost productivity and handle high-volume demands effortlessly
Support industry 4.0
Supports real-time connectivity and tracebility
Speed up your SMT line with the YP-860M, an advanced automatic FAI solution that verifies resistors, capacitors, inductors, polarity, and placement errors in seconds. With smart visual inspection, automatic BOM matching, offline programming, and ultra-fast testing, it boosts accuracy and slashes setup time by 5x over traditional methods, ideal for fast-paced electronics manufacturing.
YOUNGPOOL Technology’s YP-860M SMT Automatic First Article Inspection boosts accuracy and slashes setup time by 5x over traditional methods, ideal for fast-paced electronics manufacturing.
