SQ3000™ for SPI
Ultimate in Speed and accuracy for with Multi-Process Capabilities
What is the SQ3000 Solder Paste Inspection Machine?
SQ3000 is an all-in-one solution that’s loaded with powerful tools that cover inspection and measurement for AOI, SPI and CMM applications. SQ3000™ X offers support of large board capability of up to 710 x 610 mm board sizes.
The SQ3000 offers unmatched accuracy with the revolutionary Multi-Reflection Suppression® (MRS®) technology by meticulously identifying and rejecting reflections caused by shiny components. Effective suppression of multiple reflections is critical for accurate measurement, making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.
- Multi-process capability for 3D AOI, SPI and CMM
- Delivering metrology grade accuracy at production speed, powered by MRS Technology
- SQ3000™ X available for Large Board capability
- SQ3000 for 3D AOI, SQ3000 for 3D SPI
- SQ3000 for 2D AOI also available
FEATURES & BENEFITS
Metrology-grade accuracy at production speed enabled by MRS technology
Attain highly accurate data with the industry-leading Multi-Reflection Suppression® (MRS®) sensor technology that meticulously identifies and rejects reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurement, making MRS an ideal technology for a wide range of applications including those with very high-quality requirements.
- Attain repeatable and reproducible measurements for SMT, semiconductor, microelectronics and metrology applications.
Unmatched accuracy with Multi-Reflection Suppression®(MRS®) Sensor Technology
- Fastest 3D inspection in the industry with architecturally faster 3D sensor
- Microscopic image quality at production speed enabled by Multi-Reflection Suppression (MRS) technology
- Inhibits reflection issues with MRS technology.
- Generates high precision images of entire PCB in full colour with 3D image fusing algorithms
- Delivers precision accuracy, GR&R and lowest false call rates
- Accurate pin height/package coplanarity measurement
High Speed Inspection
Speed inspection with the MRS sensor that simultaneously captures and transmits multiple images in parallel, while highly sophisticated fusing algorithms merge the images together, delivering microscopic image quality at production speed.
Cost-savings and Efficiency
Reduce rework costs, increase throughput, improve quality with feedback, and feed forward capable SPI Systems with leading Solder Paste printer and SMT Mounter vendors.
- Advanced packaging
- Mini/micro-LED
- Advanced SMT applications for automotive, medical, military, aerospace and advanced electronics
- 008004/0201 solder paste inspection (SPI)
- Socket metrology
- Other high-end coordinate measurement (CMM) applications