Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry.
With a lineage of more than 100 years, Universal is the longest-standing electronics assembly company.
Truly universal and span the range of assembly applications- from lighting to automotive, medical, computing, entertainment, mobility, industrial and more.
500+ strong patent portfolio 27,000 + systems delivered to date
Offering the broadest range of world-class equipment and services
UIC offers a comprehensive range of solutions for Surface Mount Technology (SMT), Through-hole Technology (PTH) and Advanced Semiconductor Packaging
FuzionOF™ Platform
Address virtually any odd-form application and transform back-end assembly into a strategic advantage. FuzionOF™ features the highest available odd-form automation throughput to reduce cycle times and eliminate bottlenecks. It handles a full range of standard SMT and non-traditional components up to 150mm square and up to 40mm tall, with 5kg placement force.
Uflex™ delivers ultimate flexibility for all forms of odd-form insertion and mechanical assembly operations. It supports radial and axial insertion and provides passive and active clinching. Uflex is easily retooled for a variety of processes, including screw driving, labeling, test handling, and more, offering unsurpassed performance for single-process automation tasks at half the cost of alternative solutions
The Omni™ Inserter provides single-process efficiency to complement multi-process cells and maximize line utilization while minimizing floor space requirements. The Omni™ Inserter is part of the Universal Instruments’ Value Series that brings cost-effective intelligence, ease of use and simplicity to back-end electronics assembly automation.
FuzionSC is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor-space.
Dedicated to pre-taped radial and axial components, the Radial 88HTi™ and VCD 88HTi™ bring a new level of productivity to radial and axial component sequencing and insertion, offering consistently high throughput.
Build your most challenging products with precise, repeatable closed-loop processes – and with confidence. With Fuzion®, you can maximize utilization, Overall Equipment Effectiveness (OEE), and productivity, while minimizing cost per placement – no matter the product mix or environment.
