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FuzionSC is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor-space.
High-Speed Multi-Die Advanced Packaging with Unsurpassable Combination of Precision, Speed and Flexibility
FuzionSC™ and the HSWF™ combine to bring high productivity to advanced packaging assembly, delivering precision passive and active placement on a single platform. This solution supports virtually any feeding option and has the performance to meet high-volume targets. Together, it is the ultimate multi-die solution for heterogeneous integration.
With a comprehensive range of component handling and input types, various standard tooling, and personalized design and implementation services, the FuzionOF addresses and caters to almost any odd-form application
FuzionOF™ incorporates precise, repeatable, closed-loop processes that reduce defects, rework and waste.
Additional optional functions available to add versatility and adapt machine to fit your inspection process and needs.
Speed up your SMT line with the YP-860M, an advanced automatic FAI solution that verifies resistors, capacitors, inductors, polarity, and placement errors in seconds. With smart visual inspection, automatic BOM matching, offline programming, and ultra-fast testing, it boosts accuracy and slashes setup time by 5x over traditional methods, ideal for fast-paced electronics manufacturing.
YOUNGPOOL Technology’s YP-860M SMT Automatic First Article Inspection boosts accuracy and slashes setup time by 5x over traditional methods, ideal for fast-paced electronics manufacturing.
