Chemtronics Soder-Wick Lead-Free Desoldering Wick - 40-2-5 | JEC Technology

Product: Soder-Wick Lead-Free Desoldering Wick

Soder-Wick Lead-Free Desoldering Wick

Soder-Wick Lead-Free desoldering wick is the state of the art in desoldering technology. It is specially designed for removal of today’s high-temperature lead-free solders. The single layer weave used for Soder-Wick Lead-Free desoldering wick is lighter in mass than any other desoldering wick available and allows for lead-free solder removal at lower temperatures. Soder-Wick Lead-Free desoldering wick responds faster than any other conventional desoldering braid. This unique design minimizes overheating and requires less “contact” time thus preventing heat damage to the PCB and sensitive components. For Lead-Free rework, Soder-Wick has the answer.

Soder-Wick brand desoldering wick offers the state of the art in desoldering technology. Soder-Wick is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.

$144.25$260.00

Quantity
Unmatched odd-form automation throughput

With a comprehensive range of component handling and input types, various standard tooling, and personalized design and implementation services, the FuzionOF addresses and caters to almost any odd-form application

FuzionOF™ incorporates precise, repeatable, closed-loop processes that reduce defects, rework and waste.

xavis-a-series-featuresbenefits 1
  • 2D/3D Hybrid Inspection System with Automation Technology
  • Precise results using high-speed OCT technology
  • Built for user convenience: S/W, Table Size, etc. can be customized according to users and applications.
World-class High-resolution X-ray imaging
  • Get detailed 3-dimensional (3D) view of interal structure of the components to identify and analyze complex defects
  • Tube Focus Size: 5㎛. A closed tube source and tube focus size of 5㎛ allows for higher resolution of the X-ray image to detect smaller defect and finer details of the inspection process
  • High Resolution FPD (Flat Panel Detector) ensures that you get detailed imaging and accurate results
  • Detector Tilt (50˚) capability allows for flexibility in capturing images from different angels
Versatility and ability to adapt

Additional optional functions available to add versatility and adapt machine to fit your inspection process and needs.

  • Versatility of the machine allows for inspection of small components to large circuit board
  • Additional functions include Real 3D CT, Rotation, CT and 3D
  • Navigation User interface (CNC Programming)
  • Easy to Use & User-Friendly Operation
  • Ideal for OEMs and CEMs
Common Industrial Applications:

Made for inspection, failure analysis and package inspection of PCBs and Electronic Assemblies including

SMT Assemblies

  • Semiconductor Assemblies
  • Battery Assemblies
  • Cable Assemblies

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More Details

Packaging Options

40-
Units Per Case25 bobbins25 bobbins

 

Features & Benefits

  • Engineered specifically for high temperature, lead-free solders
  • Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids
  • Can also be used with Tin/Lead solders
  • Non-corrosive ultra high purity no-clean flux
  • Will not leave ionic contamination on the boards
  • RoHS Compliant
  • Patent Pending

 

Specifications:

  • MIL-F-14256 F
  • NASA-STD-8739.3 Soldered Electrical Connections
  • DOD-STD-883E, Method 2022
  • ANSI/IPC J STD-004, Type ROL0

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