Soder-Wick Rosin has the fastest wicking action, but rosin flux leaves behind residues that should be removed with a flux remover. Flux-Off Rosin Flux Remover is an ideal choice for your cleaning process.
Solder-Wick brand desoldering wick offers the state of the art in desoldering technology. Soder-Wick is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.
With a comprehensive range of component handling and input types, various standard tooling, and personalized design and implementation services, the FuzionOF addresses and caters to almost any odd-form application
FuzionOF™ incorporates precise, repeatable, closed-loop processes that reduce defects, rework and waste.
Additional optional functions available to add versatility and adapt machine to fit your inspection process and needs.
Made for inspection, failure analysis and package inspection of PCBs and Electronic Assemblies including
SMT Assemblies
| Part Number | Wick Size #3 Green – SW18035 | Wick Size #4 Blue – SW18045 |
| Item Description | 0.08″ / 2.0mm – best for medium pads | 0.110″ / 2.8mm – best for large pads |
| Item Size | 5′ / 1.5m L, ESD-safe bobbin 10 bobbins per resealable pouch | 5′ / 1.5m L, ESD-safe bobbin 10 bobbins per resealable pouch |
| Units Per Case | 6 pouches (60 bobbins total) | 6 pouches (60 bobbins total) |
Speed up your SMT line with the YP-860M, an advanced automatic FAI solution that verifies resistors, capacitors, inductors, polarity, and placement errors in seconds. With smart visual inspection, automatic BOM matching, offline programming, and ultra-fast testing, it boosts accuracy and slashes setup time by 5x over traditional methods, ideal for fast-paced electronics manufacturing.
YOUNGPOOL Technology’s YP-860M SMT Automatic First Article Inspection boosts accuracy and slashes setup time by 5x over traditional methods, ideal for fast-paced electronics manufacturing.
