XSCAN-H130-OCT
Description
Key Points:-
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Non-destructive X-ray inspection system for PCBs, SMT assemblies, semiconductors, and automotive components.
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Powered by a closed 130 kV X-ray source and a 5-inch Flat Panel Detector (FPD).
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Delivers system magnification up to 180x in standard mode and 90x in OCT mode.
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Features a 525 x 540 mm motorized X-Y-Z table supporting samples up to 5 kg.
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Offers 60° detector tilt, 360° continuous table rotation, and Oblique Computed Tomography (OCT) 3D rendering.
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Supports optional Cone-Beam CT 3D volumetric reconstruction.
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Driven by X-Master software and VX3D rendering engine for automated BGA void measurement, multi-point geometric analysis, and 3D filtering.
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Maintains radiation safety levels under 1 µSv/h with integrated safety interlocks.
The XSCAN-H130-OCT is a high-precision, non-destructive X-ray inspection system engineered specifically for advanced electronic manufacturing and quality control. Powered by a closed 130 kV X-ray source and a high-resolution 5-inch Flat Panel Detector (FPD), it achieves system magnification up to x180 in standard mode and x90 in Oblique Computed Tomography (OCT) mode. It is uniquely tailored to inspect dense micro-structures on modern PCBs, SMT assemblies, semiconductor chips, and automotive components without damaging the sample.
Featuring a robust mechanical manipulator with a 525 x 540 mm X-ray table, the platform supports sample weights up to 5 kg while maintaining ultra-precise motorized movement across the X, Y, and Z axes. Designed for high-throughput laboratory and production environments, the system incorporates integrated safety interlocks with radiation levels maintained under 1 . Driven by the intuitive X-Master software, it provides operators with real-time internal camera monitoring, auto-mapping, and comprehensive X-ray emission controls for reliable, continuous operation.
Features
Advanced Multi-Angle & OCT 3D Imaging
Equipped with a detector tilt and continuous table rotation, the system excels at capturing oblique views to isolate complex defect geometries. By taking rotational image series via its Oblique CT mechanism, the software reconstructs full 3D volume renderings to reveal hidden flaws such as BGA voiding, micro-cracks, and non-wetting. Optional Cone-Beam CT functionality can also be added for dedicated full-sample volumetric reconstructions.
Comprehensive Measurement & Defect Analysis
The X-Master software suite includes over 20 integrated measurement tools—ranging from basic lines and circles to complex multi-point algorithms—allowing users to calibrate pixels to absolute dimensions seamlessly. It provides automated BGA and manual void inspection utilities alongside real-time pseudo-3D surface plotting, histograms, and customizable export functions. For deeper structural review, the system easily highlights percentage defect rates in circular, rectangular, or irregular solder profiles.
Powerful Software & 3D Visualization Capabilities
Driven by a dedicated dual-workstation setup, the platform pairs an intuitive operational interface with the powerful VX3D volume rendering engine. Operators can utilize advanced 3D filtering, 2D slice windowing, nonplanar panoramic views, and automatic volume segmentation/porosity labeling. The software further streamline routine quality checks through automatic defect reporting, customizable shading presets, and full working history logs.
