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Solder-Wick Lead-Free Desoldering Wick

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Description

Key Points:-

  • Advanced, high-efficiency desoldering braid engineered specifically for the elevated thermal requirements of lead-free solder alloys (such as SAC305).

  • Constructed with a pure copper single-layer weave that optimizes heat transfer and minimizes thermal mass.

  • Pre-coated with a non-corrosive, high-speed synthetic flux that accelerates thermal response and prevents oxidation during rework.

  • Rapid wicking action allows operation at lower tip temperatures, protecting delicate PCB pads, traces, and components from pad lifting, board scorching, and overheating.

  • Non-conductive, non-corrosive flux residue meets IPC and Bellcore Surface Insulation Resistance (SIR) standards and can be left on the board or removed with Chemtronics flux removers.

  • Ideal for intricate Surface Mount Device (SMD) and through-hole rework operations.

Solder-Wick® Lead-Free Desoldering Wick is an advanced, high-efficiency desoldering braid engineered specifically to handle the elevated thermal requirements of lead-free solder alloys (such as SAC305). Distributed in Singapore by JEC Technology, this pure copper braid features a unique single-layer weave that optimizes heat transfer directly to the solder joint.

By minimizing thermal mass, Solder-Wick® Lead-Free enables rapid wicking action at lower soldering iron temperatures, significantly reducing the risk of thermal damage to sensitive PCB pads, delicate components, and thin traces. It is pre-coated with a non-corrosive, high-speed synthetic flux that accelerates thermal response and prevents oxidation during rework.

Features

The lighter mass weave construction allows maximum copper surface area contact, absorbing lead-free solder faster and more completely than standard desoldering braids. This eliminates pad lifting, board scorching, and component overheating during intricate Surface Mount Device (SMD) and through-hole rework processes.

Formulated to meet stringent IPC and Bellcore surface insulation resistance (SIR) standards, the non-conductive flux residue left after desoldering is completely safe to leave on the board or can be easily flushed off with Chemtronics flux removers. Available in various widths, it provides Singapore electronics assemblers with precise control and maximum safety.