Explore Our Printed Circuit Board Assembly (PCBA) Solutions

Elevate your electronic projects with our top-notch PCBA services. We ensure each assembly is meticulously crafted for peak performance and long-lasting durability. Whether you’re in the prototyping phase or gearing up for mass production, our PCBA offerings are designed to meet the diverse needs of various industries, helping you turn your innovative ideas into reality.

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$237.36$264.48

Powerful and economical electronic contact cleaner in an aerosol can. Remove oxidation, oil and other contaminants from contacts, metal switches, motors relays, generators, edge connectors, buss bars, circuit breakers, scales, and sensors.

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$79.50

The Plato 170 Plato shear cutter offers precise, reliable cutting action at an economical price. Thin profile handle and lightweight design are ideal for smaller hands.

$111.00

The 170LX is a remarkable advancement in lead cutter design. Carefully crafted precision cutting blades combine seamlessly with curved, palm shaped, handles to deliver effortless lead cutting and user comfort.

$296.59

Urethane conformal coating is known for its excellent moisture and chemical resistance. They are also very abrasion resistant.

$262.20

Green acrylic conformal coating insulates circuit board traces and components against high voltage arcing. Provides excellent protection from moisture and fungus.

$390.93$394.57

All foam swabs are manufactured with 100 pores per inch reticulated polyurethane foam, which ensures excellent absorbency while minimizing contamination. Tips are affixed by heat seal to prevent tip loss, even while saturated with solvent. Flexible tips provide versatility and softer touch, while rigid heads allow for more aggressive cleaning.
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Our Products

Chemtronics Freeze Spray | ES1052 | JEC Technology

$223.56

Engineered for locating thermal intermittent electrical components and cooling printed circuit boards. This circuit refrigerant system is nonflammable, residue-free and provides fast cooling action.

Engineered for locating thermal intermittent electrical components and cooling printed circuit boards. This circuit refrigerant system is nonflammable, residue-free and provides fast cooling action.

Chemtronics Ultrajet 70| ES015 | JEC Technology

$229.32

Ultrajet® 70 is an economical general-purpose air duster with a new BIGGER blast for electronic applications. Its exceptional purity jet instantly cleans surfaces free of particulate contamination.

Ultrajet® 70 is an economical general-purpose air duster with a new BIGGER blast for electronic applications. Its exceptional purity jet instantly cleans surfaces free of particulate contamination.

Chemtronics Ultrajet All-Way | ES1620 | JEC Technology

$253.92

Ultrajet® All-Way Duster is a new innovative all-way spray duster with the biggest blast to clean anything fast. This compressed gas duster can be sprayed right-side up and upside down emitting a high pressure blast that cleans electronics without scratching delicate surfaces.

Ultrajet® All-Way Duster is a new innovative all-way spray duster with the biggest blast to clean anything fast. This compressed gas duster can be sprayed right-side up and upside down emitting a high pressure blast that cleans electronics without scratching delicate surfaces.

YOUNGPOOL Vacuum Degassing System N-800A | JEC Technology

Streamline your electronics manufacturing process with the N-800A, a single-lane vacuum degassing system engineered for high-performance bubble removal. Designed for PCBs up to 500x500mm.

Streamline your electronics manufacturing process with the N-800A, a single-lane vacuum degassing system engineered for high-performance bubble removal. Designed for PCBs up to 500x500mm.

YOUNGPOOL SMT Automatic First Article Inspection YP-860M | JEC Technology

Speed up your SMT line with the YP-860M, an advanced automatic FAI solution that verifies resistors, capacitors, inductors, polarity, and placement errors in seconds. With smart visual inspection, automatic BOM matching, offline programming, and ultra-fast testing, it boosts accuracy and slashes setup time by 5x over traditional methods, ideal for fast-paced electronics manufacturing.

Speed up your SMT line with the YP-860M, an advanced automatic FAI solution that verifies resistors, capacitors, inductors, polarity, and placement errors in seconds. With smart visual inspection, automatic BOM matching, offline programming, and ultra-fast testing, it boosts accuracy and slashes setup time by 5x over traditional methods, ideal for fast-paced electronics manufacturing.

Universal Instruments Fuzion Platform | JEC Technology

Build your most challenging products with precise, repeatable closed-loop processes – and with confidence. With Fuzion®, you can maximize utilization, Overall Equipment Effectiveness (OEE), and productivity, while minimizing cost per placement – no matter the product mix or environment.

Build your most challenging products with precise, repeatable closed-loop processes – and with confidence. With Fuzion®, you can maximize utilization, Overall Equipment Effectiveness (OEE), and productivity, while minimizing cost per placement – no matter the product mix or environment.

Universal Instruments Generation 88HTi | JEC Technology

Dedicated to pre-taped radial and axial components, the Radial 88HTi™ and VCD 88HTi™ bring a new level of productivity to radial and axial component sequencing and insertion, offering consistently high throughput.

Dedicated to pre-taped radial and axial components, the Radial 88HTi™ and VCD 88HTi™ bring a new level of productivity to radial and axial component sequencing and insertion, offering consistently high throughput.

Universal Instruments FuzionSC Platform | JEC Technology

FuzionSC is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor-space.

 

FuzionSC is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor-space.

 

Universal Instruments Omni Inserter | JEC Technology

The Omni™ Inserter provides single-process efficiency to complement multi-process cells and maximize line utilization while minimizing floor space requirements. The Omni™ Inserter is part of the Universal Instruments’ Value Series that brings cost-effective intelligence, ease of use and simplicity to back-end electronics assembly automation.

The Omni™ Inserter provides single-process efficiency to complement multi-process cells and maximize line utilization while minimizing floor space requirements. The Omni™ Inserter is part of the Universal Instruments’ Value Series that brings cost-effective intelligence, ease of use and simplicity to back-end electronics assembly automation.

Universal Instruments UFLEX | JEC Technology

Uflex™ delivers ultimate flexibility for all forms of odd-form insertion and mechanical assembly operations. It supports radial and axial insertion and provides passive and active clinching. Uflex is easily retooled for a variety of processes, including screw driving, labeling, test handling, and more, offering unsurpassed performance for single-process automation tasks at half the cost of alternative solutions

Uflex™ delivers ultimate flexibility for all forms of odd-form insertion and mechanical assembly operations. It supports radial and axial insertion and provides passive and active clinching. Uflex is easily retooled for a variety of processes, including screw driving, labeling, test handling, and more, offering unsurpassed performance for single-process automation tasks at half the cost of alternative solutions

Universal Instruments FuzionOF | JEC Technology

Address virtually any odd-form application and transform back-end assembly into a strategic advantage. FuzionOF™ features the highest available odd-form automation throughput to reduce cycle times and eliminate bottlenecks. It handles a full range of standard SMT and non-traditional components up to 150mm square and up to 40mm tall, with 5kg placement force.

Address virtually any odd-form application and transform back-end assembly into a strategic advantage. FuzionOF™ features the highest available odd-form automation throughput to reduce cycle times and eliminate bottlenecks. It handles a full range of standard SMT and non-traditional components up to 150mm square and up to 40mm tall, with 5kg placement force.

Hover-Davis AXIUM Label and Media Presenter Transparent Background

Automate your process while improving placement accuracy, speed and quality. The AXIUM Media Presenter provides a machine mountable solution that turns any pick and place platform into a flexible alternative to hand assembly.

Automate your process while improving placement accuracy, speed and quality. The AXIUM Media Presenter provides a machine mountable solution that turns any pick and place platform into a flexible alternative to hand assembly.