Maintaining impeccable cleanliness in PCB Assembly (PCBA) processes is critical for ensuring the reliability, performance, and longevity of electronic products.
At JEC Technology, we are proud to offer Techspray and Chemtronic’s advanced cleaning solutions, designed to meet the rigorous demands of modern manufacturing.
Whether you’re tackling solder flux residues, oils, adhesives, or general contaminants, our products deliver the precision and reliability you need for effective PCBA cleaning and degreasing.
Cleaning is a critical step in the PCB Assembly (PCBA) process, ensuring the functionality, reliability, and longevity of electronic products. As PCBs become more compact and intricate, maintaining a contaminant-free surface is essential to avoid defects and performance issues.
Common cleaning applications within the PCB Assembly process
By removing contaminants, cleaning ensures that PCBs perform reliably under demanding conditions, helping manufacturers achieve consistent quality, reduce rework, and maintain the stringent standards required by industries such as electronics, automotive, and aerospace. Investing in proper cleaning processes is not just about meeting quality requirements—it is about safeguarding the performance and reputation of the products and the brand.
Designed to meet ANSI/ESDS20.20 standards, these solutions, including cleaners, lotions, and coatings, help maintain static-free environments, ensuring the reliability and longevity of electronics during assembly and maintenance.
Techspray’s PFAS-free cleaning solutions deliver outstanding cleaning performance while addressing the growing need for environmentally responsible alternatives. Designed to eliminate harmful per- and polyfluoroalkyl substances (PFAS), these products support sustainability goals without compromising on effectiveness.
Ideal for replacing traditional high-GWP solvents in PCBA cleaning processes
Designed with both performance and safety in mind, Coventry solvent cleaners, swelling agents, and carrier fluids are manufactured to exacting specifications, ensuring unmatched reliability and effectiveness.
Ideal choice for industries requiring precision and compliance such as electronics manufacturing, medical devices, aerospace and cleanroom environments
Whether choosing from their extensive off-the-shelf product range or opting for a customized solution, Coventry cleaning products are the trusted choice for industries that demand precision and compliance.
Deliver a fast-evaporating, super-chilling liquid to isolate faults in capacitors, resistors, and semiconductors.
Ideal for identifying cold solder joints, PCB cracks, and oxidized junctions ensuring precise and effective diagnostics
Designed for convenience, the powerful spray reaches crevices, eliminating insulative buildup without scrubbing. The electrical contact cleaners ensure efficient maintenance and reliable electrical performance.
Ideal for removing oxidation, grease, and dirt from connectors, switches, relays and components
Ideal for removing oxidation, grease, and dirt from connectors, switches, relays and components
At JEC Technology, we are committed to providing manufacturers with solutions that streamline production processes and improve efficiency. Our curated portfolio includes industry-leading products from Hover-Davis, Universal Instruments Corporation, and Youngpool, ensuring that your material feeding and handling systems deliver exceptional performance.
Enhanced Productivity: Reduce downtime with reliable feeding and splicing systems.
Precision and Quality: Achieve consistent results with advanced feeders and wafer handling equipment.
Future-Ready Solutions: Stay ahead with scalable and adaptable systems designed for modern manufacturing challenges.
Contact us today to learn how our material feeding and handling solutions canoptimize your operations and elevate your production capabilities.
Ready to optimize your PCBA cleaning and degreasing processes? Explore Techspray’s advanced cleaning solutions at JEC Technology and achieve the reliability and performance your manufacturing process demands.
Contact us today to learn more about our cleaning products and how they can elevate your production quality.
QF Series feeders offer versatile electronic multipitch operation. Pitch selection via a selector button means that a single feeder can be used for several component pitch types. The result is that less feeder inventory is required compared to traditional fixed pitch feeders.
Fuji Compatible Tape Feeder for OEM and Automation
High-Volume Embossed Tape Feeders for Seamless Automation System Integration Reliable, high-performance tape feeders for optimized integration into modern automation systems.
High-Volume Embossed Tape Feeders for Automation System Integration
Reliable, high-performance tape feeders for optimized integration into modern automation systems. SA Series is built for high-volume, precision feeding of embossed tape in automated assembly systems. The 8mm triple track system with independent lanes provides a 3-feeder-in 1 advantage for enhanced component placement capacity and lowering cost per pick point.
Feeders are available in multiple widths to support a wide range of component formats
Automate your process while improving placement accuracy, speed and quality. The AXIUM Media Presenter provides a machine mountable solution that turns any pick and place platform into a flexible alternative to hand assembly.
Ultimate label & Die-cut Material Automation Feeder For SMT & Automation Needs
Automate your process while improving placement accuracy, speed and quality. The AXIUM Media Presenter provides a machine mountable solution that turns any pick and place platform into a flexible alternative to hand assembly. The Hover-Davis AXIUM Label & Media Presenter is a flexible alternative for placing labels automatically with existing pick and place equipment. It is no longer necessary to hand place labels or other adhesive backed media.
FuzionSC is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor-space.
High-Speed Multi-Die Advanced Packaging with Unsurpassable Combination of Precision, Speed and Flexibility
FuzionSC™ and the HSWF™ combine to bring high productivity to advanced packaging assembly, delivering precision passive and active placement on a single platform. This solution supports virtually any feeding option and has the performance to meet high-volume targets. Together, it is the ultimate multi-die solution for heterogeneous integration.
