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SA Series Tape Feeder

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Description

Key Points:-

  • High-volume embossed tape feeders for automated SMT assembly lines.

  • Features 8mm triple-track layout with three independent lanes in a single slot.

  • Driven by micro-stepping actuation for precise indexing control per lane.

  • Features integrated optical/tension sensors to detect feed state, tape position, and empty pockets.

  • Includes quick-mount alignment interfaces for rapid changeovers.

  • Accommodates multiple tape widths, carrier pitch formats, and reel configurations.

JEC Technology distributes the SA Series High-Volume Embossed Tape Feeders, engineered for seamless integration into high-speed automated assembly systems in Singapore. Designed for continuous, high-precision component delivery, the SA Series minimizes indexing jitter and backlash to optimize pick-and-place uptime and overall equipment effectiveness (OEE).

The core architecture utilizes an 8mm triple-track layout with three fully independent lanes, delivering a 3-feeder-in-1 density advantage. This multi-lane design maximizes pick-point capacity within existing feeder bank footprints, significantly lowering overall cost per pick point while supporting versatile reel configurations.

Supporting multiple tape width variants and carrier pitch formats, the SA Series provides complete component adaptability across diverse SMT and automated assembly lines. JEC Technology delivers direct integration assistance, system calibration, and local technical support to ensure optimal line throughput.

Key Features

  • Independent Multi-Lane Drive: High-precision micro-stepping actuation on each lane enables precise individual indexing control, preventing tape stretch and component displacement during rapid feeding cycles.
  • Compact High-Density Design: The 8mm triple-track form factor triples component density per feeder slot, minimizing platform real estate while maintaining high positional accuracy.
  • Broad Component & Tape Support: Available in multiple track width configurations to handle varied tape carrier depths, embossed cover tapes, and diverse component packages.
  • Real-Time Sensor Verification: Integrated Optical/Tension sensors actively monitor feed state, tape position, and feeder readiness to prevent mispicks and empty pockets.
  • Rapid Changeover & Maintenance: Designed with quick-mount alignment interfaces and durable wear-resistant components for fast line reconfigurations and extended operational lifespans.