As industries like semiconductors, electronics, automotive, and medical devices continue to advance, maintaining impeccable product quality has become a critical challenge. The increasing complexity of manufacturing processes—driven by miniaturization, high-density integration, and fast-paced production demands—requires robust and innovative inspection solutions.
Traditional methods often fail to detect hidden defects, such as voids, misalignments, cracks, and soldering issues, especially in densely packed assemblies. These undetected flaws lead to higher rework costs, production delays, and compromised product reliability.
This is where XAVIS X-ray inspection systems, offered by JEC Technology, excel. With state-of-the-art non-destructive testing (NDT) capabilities, XAVIS ensures precision and reliability at every stage of production.
XAVIS is a global leader in X-ray inspection solutions, catering to the stringent demands of advanced manufacturing. With a strong focus on innovation, XAVIS systems deliver high-speed, precise, and flexible inspection capabilities. These solutions enable manufacturers to maintain superior production quality, optimize yields, and identify even the smallest defects to prevent costly failures and ensure product integrity.
XAVIS systems incorporate cutting-edge imaging technology to provide comprehensive and accurate inspection results. The combination of 2D and 3D hybrid inspection capabilities allows manufacturers to detect a wide range of defects, including voids, cracks, and misalignments, in multi-layered assemblies. Equipped with flat panel detectors (FPD) that reduce magnification errors, these systems enable precise imaging, making them ideal for inspecting large PCBs and high-density components.
XAVIS X-ray systems combine real-time NDT capabilities with advanced defect detection to optimize production yields. Designed for fast-paced manufacturing environments, these systems perform seamless, high-speed inspections without disrupting production lines. By identifying defects such as voids, misalignments, and poor solder joints early in the process, manufacturers can reduce material waste, minimize costly rework, and ensure consistent product quality. This combination of speed and defect prevention makes XAVIS systems an essential tool for operational efficiency and production reliability.
XAVIS systems are highly adaptable and support a wide range of manufacturing processes. Whether it’s semiconductors, SMT/PCB assemblies, batteries, or die-cast components, XAVIS delivers unparalleled accuracy for diverse applications. This versatility makes it a go-to solution for industries that require stringent quality control.
Ideal for OEMs and CEMs across various industries
XAVIS X-ray systems are designed to adapt to a wide range of manufacturing processes, offering unparalleled accuracy for various industries:
The XSCAN A-Series is engineered for applications like SMT assembly, semiconductor manufacturing, package inspections, and failure analysis.
It offers:
At JEC Technology, we are dedicated to delivering advanced solutions that drive efficiency and quality in modern manufacturing.
Partnering with XAVIS ensures access to industry-leading inspection systems designed to overcome today’s challenges.
With XAVIS, you can achieve:
Higher Yields: Detect and correct defects early to minimize rework and material waste.
Enhanced Product Quality: Ensure reliability and compliance with strict industry standards.
Increased Efficiency: Seamlessly integrate into your production line for real-time, high-speed inspections.
Ready to transform your quality assurance processes? Contact JEC Technology today to learn how XAVIS X-ray inspection systems can help you overcome manufacturing challenges and elevate your production capabilities.
L-900 Automatic splicing machine delivers unsurpassed splicing reliability to drive improved yields and utilization with its seamless integration with MES and high degree of automation. L-900 is a 8mm/12mm/16mm/24mm SMT splicing machine with superior adhesive strength.
8mm/12mm/16mm/24mm Splicing machine with superior adhesive strength, unsurpassed splicing reliability, and a high degree of automation
Designed for the automation of a production line with an SMT placement machine. Paper and plastic tape with the exact specification can realise automatic correction and splicing of two rolls of tapes with a width of 8mm to 24mm. In splicing, the equipment can automatically realise accurate cutting and splicing, and connect the head and tail of two rolls of tapes by high-adhesion film, to realise continuous production.
L-4 Automatic Splicing Machine is designed for the automatic production line of SMT placement machine. In the process of splicing, the equipment can automatically realize accurate cutting and splicing, and automatically connect the head and tail of two rolls of tapes by high adhesion film, so as to realize continuous production.
Designed to address splicing process inefficiencies, quality concerns and production bottlenecks
The L-4 intelligent splicing solution not only integrates with MES for superior traceability but also delivers unmatched precision, reliability, and ease of use. With its cutting-edge features, the L-4 transforms the splicing process into a streamlined, high-efficiency operation, making it an essential tool for modern SMT electronics manufacturing.
A high-speed and versatile dual-head laser marking system ideal for reliable part traceability and quality control. Features dual-head and dual-camera configurations for top/bottom marking, Z-axis flexibility, fume detection, and optional dual conveyors—ideal for high-throughput, multi-material applications.
A high-speed and versatile solution ideal for automated production lines that require flexibility, dual-side marking and high throughput
Speed up your SMT line with the YP-860M, an advanced automatic FAI solution that verifies resistors, capacitors, inductors, polarity, and placement errors in seconds. With smart visual inspection, automatic BOM matching, offline programming, and ultra-fast testing, it boosts accuracy and slashes setup time by 5x over traditional methods, ideal for fast-paced electronics manufacturing.
YOUNGPOOL Technology’s YP-860M SMT Automatic First Article Inspection boosts accuracy and slashes setup time by 5x over traditional methods, ideal for fast-paced electronics manufacturing.
Streamline your electronics manufacturing process with the N-800A, a single-lane vacuum degassing system engineered for high-performance bubble removal. Designed for PCBs up to 500x500mm.
Streamline your electronics manufacturing process with the N-800A, a single-lane vacuum degassing system engineered for high-performance bubble removal.
